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[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - 16.4 0.6-to-1.0V 279μm<sup>2</sup>, 0.92μW temperature sensor with less than +3.2/-3.4°C error for on-chip dense thermal monitoring

[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - 16.4 0.6-to-1.0V 279μm2, 0.92μW temperature sensor with less than +3.2/-3.4°C error for on-chip dense thermal monitoring

Yang, Teng; Kim, Seongjong; Kinget, Peter R.; Seok, Mingoo
  • 作者Yang, Teng; Kim, Seongjong; Kinget, Peter R.; Seok, Mingoo
  • 文件大小7979.29KB
  • 发表时间2014
  • DOI10.1109/isscc.2014.6757435
  • 页码282-283
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