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[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A study of isolation test on FullPAK device

[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A study of isolation test on FullPAK device

Gan, S. Y.; Alias, Lokman; Ng, W. Y.

作者Gan, S. Y.; Alias, Lokman; Ng, W. Y.
文件大小2270.75KB
发表时间2014
DOI10.1109/ipfa.2014.6898148
页码160-164

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