[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Electromigration reliability of solder bumps
- 作者Ceric, Hajdin; Selberherr, Siegfried
- 文件大小1215.38KB
- 发表时间2014
- DOI10.1109/ipfa.2014.6898145
- 页码336-339