Editorial
- 期刊名称Microelectronics Reliability
- 作者Boit, Christian
- 卷第54卷
- 印刷ISSN0026-2714
- 文件大小166.96KB
- 发表时间2014-09
- DOI10.1016/j.microrel.2014.08.008
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Electroluminescence characterization of AlGaN/GaN HEMTsRichard Lossy; Arkadiusz Glowacki; Christian Boit; Joachim Würfl · 2009
Assessment of a Chip Backside ProtectionAmini, Elham; Beyreuther, Anne; Herfurth, Norbert; Steigert, Alexander; Szyszka, Bernd; Boit, Christian · Journal of Hardware and Systems Security · 2018
Testing and failure analysis of thin film solar cellsChristian Boit; Mahyar Boostandoost; Felice Friedrich; Arkadiusz Glowacki · 2011
2D modelling of polycrystalline silicon thin film solar cellsTeodoreanu, Ana-Maria; Friedrich, Felice; Leihkauf, Rainer; Boit, Christian; Leendertz, Caspar; Korte, Lars · EPJ Photovoltaics · 2013
Focused ion beam contact to non-volatile memory cellsHelfmeier, Clemens; Schlangen, Rudolf; Boit, Christian · Microelectronics Reliability · 2014
Ultra sensitive measurement of dielectric current under pulsed stress conditionsHelfmeier, Clemens; Beyreuther, Anne; Fox, Alexander; Boit, Christian · Microelectronics Reliability · 2015
Photonic Side-Channel Analysis of Arbiter PUFsTajik, Shahin; Dietz, Enrico; Frohmann, Sven; Dittrich, Helmar; Nedospasov, Dmitry; Helfmeier, Clemens; Seifert, Jean-Pierre; Boit, Christian; Hübers, Heinz-Wilhelm · Journal of Cryptology · 2017
Thermal heating within SOIKoning, J.J.; Lecaudey, S.; Spaan, E.; Stoutjesdijk, M.; Janssen, J.H.J. · Microelectronics Reliability · 2008
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RF CMOS reliability simulationsSasse, Guido T.; Acar, Mustafa; Kuper, Fred G.; Schmitz, Jurriaan · Microelectronics Reliability · 2008
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Book ReviewNaikan, Vallayil N.A. · Microelectronics Reliability · 2013
Endurance behavior of conductive yarnsde Vries, Hans; Cherenack, Kunigunde H. · Microelectronics Reliability · 2014
Trends in automotive power semiconductor packagingDietrich, Peter · Microelectronics Reliability · 2013