Damage Evaluation of Wet-Chemical Si-Wafer Thinning/Backside Via Exposure Process
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Watanabe, Naoya; Miyazaki, Takumi; Yoshikawa, Kazuhiro; Aoyagi, Masahiro
- 卷第4卷
- 期第4期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小4335.01KB
- 发表时间2014-4
- DOI10.1109/tcpmt.2014.2304462
- 页码741-747
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