[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Impacts of Cu contamination in 3D integration process on memory retention characteristics in thinned DRAM chip

Lee, Kangwook; Tanikawa, Seiya; Naganuma, Hideki; Bea, Jichel; Murugesan, Mariappine; Fukushima, Takafumi; Tanaka, Tetsu; Koyanagi, Mitsumasa

作者Lee, Kangwook; Tanikawa, Seiya; Naganuma, Hideki; Bea, Jichel; Murugesan, Mariappine; Fukushima, Takafumi; Tanaka, Tetsu; Koyanagi, Mitsumasa
文件大小5907.49KB
发表时间2014
DOI10.1109/irps.2014.6860634

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