[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Electromigration reliability of open TSV structures
- 作者Zisser, Wolfhard H.; Ceric, Hajdin; Weinbub, Josef; Selberherr, Siegfried
- 文件大小782.14KB
- 发表时间2014
- DOI10.1109/ipfa.2014.6898179
- 页码317-320
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