[IEEE 2014 27th International Conference on VLSI Design - India (2014.01.5-2014.01.9)] 2014 27th International Conference on VLSI Design and 2014 13th International Conference on Embedded Systems - Active Cooling Technique for Efficient Heat Mitigation in 3D-ICs
- 作者Kaddi, Pramod; Reddy, Basireddy Karunakar; Singh, Shiv Gobind
- 文件大小296.73KB
- 发表时间2014
- DOI10.1109/vlsid.2014.92
- 页码495-498
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