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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - The study of novel metal/composite thermal interface materials for chip testing

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - The study of novel metal/composite thermal interface materials for chip testing

Shen, Wang; Xionghui, Cai; Guang, Chen; Fengshun, Wu; Weishen, Xia; Wenbo, Zhu; Ruhua, Liu; Yi, Zhang
  • 作者Shen, Wang; Xionghui, Cai; Guang, Chen; Fengshun, Wu; Weishen, Xia; Wenbo, Zhu; Ruhua, Liu; Yi, Zhang
  • 文件大小444.25KB
  • 发表时间2014
  • DOI10.1109/icept.2014.6922671
  • 页码352-355
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