[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Thermal performance investigation of three-dimensional structure unit in double-sided cooling IGBT module
- 作者Wang, Chunlei; Zheng, Libing; Han, Li; Fang, Huachao; Xu, Ju
- 文件大小414.46KB
- 发表时间2014
- DOI10.1109/icept.2014.6922733
- 页码622-625