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Experimental and Numerical Analysis of Springback Behavior Under Elevated Temperatures in Micro Bending Assisted by Resistance Heating

Experimental and Numerical Analysis of Springback Behavior Under Elevated Temperatures in Micro Bending Assisted by Resistance Heating

Zheng, Qiu; Aoyama, Tatsuya; Shimizu, Tetsuhide; Yang, Ming
  • 期刊名称Procedia Engineering
  • 作者Zheng, Qiu; Aoyama, Tatsuya; Shimizu, Tetsuhide; Yang, Ming
  • 卷第81卷
  • 印刷ISSN1877-7058
  • 文件大小851.50KB
  • 发表时间2014
  • DOI10.1016/j.proeng.2014.10.177
  • 页码1481-1486
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