Experimental and Numerical Analysis of Springback Behavior Under Elevated Temperatures in Micro Bending Assisted by Resistance Heating
Zheng, Qiu; Aoyama, Tatsuya; Shimizu, Tetsuhide; Yang, Ming
- 期刊名称Procedia Engineering
- 作者Zheng, Qiu; Aoyama, Tatsuya; Shimizu, Tetsuhide; Yang, Ming
- 卷第81卷
- 印刷ISSN1877-7058
- 文件大小851.50KB
- 发表时间2014
- DOI10.1016/j.proeng.2014.10.177
- 页码1481-1486