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[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Thermal ions diffusion on printed circuit board

[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Thermal ions diffusion on printed circuit board

Yeoh, Lai-Seng; Chong, Kok-Cheng; Li, Susan
  • 作者Yeoh, Lai-Seng; Chong, Kok-Cheng; Li, Susan
  • 文件大小1957.90KB
  • 发表时间2014
  • DOI10.1109/ipfa.2014.6898138
  • 页码54-57
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