[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effect of thermal annealing on TSV Cu protrusion and local stress

Jing, Xiangmeng; He, Hongwen; Ji, Liang; Xu, Cheng; Xue, Kai; Su, Meiying; Song, Chongshen; Yu, Daquan; Cao, Liqiang; Zhang, Wenqi; Shangguan, Dongkai

作者Jing, Xiangmeng; He, Hongwen; Ji, Liang; Xu, Cheng; Xue, Kai; Su, Meiying; Song, Chongshen; Yu, Daquan; Cao, Liqiang; Zhang, Wenqi; Shangguan, Dongkai
文件大小3064.41KB
发表时间2014
DOI10.1109/ectc.2014.6897429
页码1116-1121

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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effect of thermal annealing on TSV Cu protrusion and local stress