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[IEEE 2014 20th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Greenwich, London, United Kingdom (2014.9.24-2014.9.26)] 20th International Workshop on Thermal Investigations of ICs and Systems - Thermal properties of interconnects in power MOSFETs

[IEEE 2014 20th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Greenwich, London, United Kingdom (2014.9.24-2014.9.26)] 20th International Workshop on Thermal Investigations of ICs and Systems - Thermal properties of interconnects in power MOSFETs

Burenkov, Alex; Baer, Eberhard; Boianceanu, Cristian

作者Burenkov, Alex; Baer, Eberhard; Boianceanu, Cristian
文件大小3482.21KB
发表时间2014
DOI10.1109/therminic.2014.6972518
页码1-6

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