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Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

Lau, John H.

期刊名称Journal of Electronic Packaging
作者Lau, John H.
卷第136卷
期第4期
DOI210.0000/electronicpackaging.asmedigitalcollection.asme.org/generic-B50CB6A34BC7
印刷ISSN1043-7398
文件大小4522.13KB
发表时间2014-10-15
DOI10.1115/1.4028629

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