Solder Bumps Inspection UsingPrincipal Component Analysis in Active Thermography
- 期刊名称Advanced Materials Research
- 作者Lu, Xiang Ning; Han, Ji Guang; Han, Su Hua; Wang, Su Ya; Shao, Ming Hui
- 电子ISSN1662-8985
- 文件大小468.91KB
- 发表时间2014-4
- DOI10.4028/www.scientific.net/AMR.912-914.1529
- 页码1529-1533
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