Simulation of Chip Formation Behavior during Single Diamond Grains Grinding by CEL Method
Dai, Chen Wei; Xu, Jiu Hua; Ding, Wen Feng; Dai, Jian Bo; Fu, Yu Can
- 期刊名称Advanced Materials Research
- 作者Dai, Chen Wei; Xu, Jiu Hua; Ding, Wen Feng; Dai, Jian Bo; Fu, Yu Can
- 卷第1017卷
- 电子ISSN1662-8985
- 文件大小415.91KB
- 发表时间2014-9
- DOI10.4028/www.scientific.net/amr.1017.598
- 页码598-603