[IEEE 2014 International 3D Systems Integration Conference (3DIC) - Kinsdale, Ireland (2014.12.1-2014.12.3)] 2014 International 3D Systems Integration Conference (3DIC) - Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration
- 作者Fukushima, Takafumi; Ito, Yuka; Murugesan, Mariappan; Bea, Jicheol; Lee, Kangwook; Choki, Koji; Tanaka, Tetsu; Koyanagi, Mitsumasa
- 文件大小635.93KB
- 发表时间2014
- DOI10.1109/3DIC.2014.7152145
- 页码1-4
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