发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Development of void free, high reliability underfill encapsulated fine pitch system on flex packages

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Development of void free, high reliability underfill encapsulated fine pitch system on flex packages

Pun, Kelvin; Sharma, Anupam; Singh, Amandeep; Islam, M. N.; Ng, Tin Wing
  • 作者Pun, Kelvin; Sharma, Anupam; Singh, Amandeep; Islam, M. N.; Ng, Tin Wing
  • 文件大小1010.22KB
  • 发表时间2014
  • DOI10.1109/ESTC.2014.6962785
  • 页码1-5
同期刊推荐
← 返回【学霸图书馆】主页
© 2026 学霸图书馆 · 让阅读成为习惯