[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Comparison between ENA and ENEPIG surface finish for high density TBGA package
- 作者Pun, Kelvin; Islam, M. N.; Ng, Tin Wing
- 文件大小1090.89KB
- 发表时间2014
- DOI10.1109/ESTC.2014.6962847
- 页码1-4
Protein surface recognition by calixarenesZadmard, Reza; Alavijeh, Nahid S. · RSC Adv. · 2014
Pentakis(trifluoromethyl)phenol from NitrobenzeneKütt, Agnes; Koppel, Ilmar A. · RSC Adv. · 2014
Polypyrrole derivatives for electrochromic applicationsCamurlu, Pinar · RSC Adv. · 2014
Naturally occurring organoiodinesWang, Lishu; Zhou, Xuefeng; Fredimoses, Mangaladoss; Liao, Shengrong; Liu, Yonghong · RSC Adv. · 2014
Electron scattering from germanium tetrafluorideGoswami, Biplab; Naghma, Rahla; Antony, Bobby · RSC Adv. · 2014
Computational aspects of hydroformylationKégl, Tamás · RSC Adv. · 2015
Substitution rules for icosahedral quasicrystalsMadison, Alexey E. · RSC Adv. · 2015
Polymer-immobilized chiral catalystsItsuno, Shinichi; Hassan, Md. Mehadi · RSC Adv. · 2014