[IEEE 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2014.10.26-2014.10.29)] 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems - Analysis of Wireless Power Transfer system design on active silicon interposer for low voltage applications in 3D-IC

• 作者Song, Jinwook; Kim, Sukjin; Bae, Bumhee; Kim, Hongseok; Kim, Jonghoon J.; Kim, Dong-Hyun Bill; Kim, Joungho
• 文件大小637.83KB
• 发表时间2014
• DOI10.1109/EPEPS.2014.7103639
• 页码223-226