[IEEE 2014 20th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Greenwich, London, United Kingdom (2014.9.24-2014.9.26)] 20th International Workshop on Thermal Investigations of ICs and Systems - Thermal characterization of percolating thermal underfills: Bulk and cavity
Burg, Brian R.; Koilly, Manuel; Yu, Kerry; Zurcher, Jonas; Schlottig, Gerd; Brunschwiler, Thomas
- 作者Burg, Brian R.; Koilly, Manuel; Yu, Kerry; Zurcher, Jonas; Schlottig, Gerd; Brunschwiler, Thomas
- 文件大小2888.48KB
- 发表时间2014
- DOI10.1109/therminic.2014.6972493
- 页码1-6