[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of annealing after copper plating on the pumping behavior of through silicon vias
- 作者Ji, Liang; Jing, Xiangmeng; Xue, Kai; Xu, Cheng; He, Hongwen; Zhang, Wenqi
- 文件大小610.46KB
- 发表时间2014
- DOI10.1109/icept.2014.6922608
- 页码101-104
[IEEE 2015 IEEE International Conference on Electrical, Computer and Communication Technologies (ICECCT) - Coimbatore, India (2015.3.5-2015.3.7)] 2015 IEEE International Conference on Electrical, Computer and Communication Technologies (ICECCT) - Committees2015
[IEEE 2015 IEEE International Conference on Electrical, Computer and Communication Technologies (ICECCT) - Coimbatore, India (2015.3.5-2015.3.7)] 2015 IEEE International Conference on Electrical, Computer and Communication Technologies (ICECCT) - Content2015
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[IEEE 2015 IEEE International Conference on Electrical, Computer and Communication Technologies (ICECCT) - Coimbatore, India (2015.3.5-2015.3.7)] 2015 IEEE International Conference on Electrical, Computer and Communication Technologies (ICECCT) - ChairmanChandrasekarn, S. · 2015
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[IEEE 2015 IEEE International Conference on Electrical, Computer and Communication Technologies (ICECCT) - Coimbatore, India (2015.3.5-2015.3.7)] 2015 IEEE International Conference on Electrical, Computer and Communication Technologies (ICECCT) - [Copyright notice]2015
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