[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Packaging and process optimization for three-dimensional structure unit of double-sided cooling IGBT module

• 作者Wang, Chunlei; Zheng, Libing; Han, Li; Fang, Huachao; Xu, Ju
• 文件大小678.28KB
• 发表时间2014
• DOI10.1109/isaf.2014.6917943
• 页码626-629