Computational Analysis on Thermal Performance of 2.5D Package
- 期刊名称Transactions of The Japan Institute of Electronics Packaging
- 作者Hisada, Takashi; Yamada, Yasuharu
- 卷第7卷
- 期第1期
- 印刷ISSN1883-3365
- 电子ISSN1884-8028
- 文件大小1895.54KB
- 发表时间2014
- DOI10.5104/jiepeng.7.114
- 页码114-122
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