发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

Fabrication and electrical characteristics of a novel interposer with polymer liner and silicon pillars with ultra-low-resistivity as through-silicon-vias (TSVs) for 2.5D/3D applications

Fabrication and electrical characteristics of a novel interposer with polymer liner and silicon pillars with ultra-low-resistivity as through-silicon-vias (TSVs) for 2.5D/3D applications

Chen, Qian-Wen; Yan, Yang-Yang; Ding, Ying-Tao; Wang, Shi-Wei; Wang, Wei-Jiang
  • 期刊名称Microsystem Technologies
  • 作者Chen, Qian-Wen; Yan, Yang-Yang; Ding, Ying-Tao; Wang, Shi-Wei; Wang, Wei-Jiang
  • 卷第21卷
  • 期第10期
  • 印刷ISSN0946-7076
  • 电子ISSN1432-1858
  • 文件大小819.83KB
  • 发表时间2015-10-4
  • DOI10.1007/s00542-014-2324-3
  • 页码2207-2214
← 返回【学霸图书馆】主页