Fabrication and electrical characteristics of a novel interposer with polymer liner and silicon pillars with ultra-low-resistivity as through-silicon-vias (TSVs) for 2.5D/3D applications
Chen, Qian-Wen; Yan, Yang-Yang; Ding, Ying-Tao; Wang, Shi-Wei; Wang, Wei-Jiang
- 期刊名称Microsystem Technologies
- 作者Chen, Qian-Wen; Yan, Yang-Yang; Ding, Ying-Tao; Wang, Shi-Wei; Wang, Wei-Jiang
- 卷第21卷
- 期第10期
- 印刷ISSN0946-7076
- 电子ISSN1432-1858
- 文件大小819.83KB
- 发表时间2015-10-4
- DOI10.1007/s00542-014-2324-3
- 页码2207-2214