Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias

• 期刊名称IEEE Transactions on Electron Devices
• 作者Lu, Qijun; Zhu, Zhangming; Yang, Yintang; Ding, Ruixue
• 卷第62卷
• 期第5期
• 印刷ISSN0018-9383
• 电子ISSN1557-9646
• 文件大小2322.18KB
• 发表时间2015-5
• DOI10.1109/ted.2015.2410312
• 页码1544-1552