[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis
- 作者Vandevelde, Bart; Zanon, Franco; Griffoni, Alessio; Li, Xiaolong; Willems, Geert; Meneghini, Matteo
- 文件大小2034.86KB
- 发表时间2015
- DOI10.1109/EuroSimE.2015.7103170
- 页码1-4
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