High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Bleiker, Simon J.; Fischer, Andreas C.; Shah, Umer; Somjit, Nutapong; Haraldsson, Tommy; Roxhed, Niclas; Oberhammer, Joachim; Stemme, Goran; Niklaus, Frank
- 卷第5卷
- 期第1期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小4384.93KB
- 发表时间2015-1
- DOI10.1109/TCPMT.2014.2369236
- 页码21-27
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