Intrinsic stress analysis of tungsten-lined open TSVs
- 期刊名称Microelectronics Reliability
- 作者Filipovic, Lado; Singulani, Anderson Pires; Roger, Frederic; Carniello, Sara; Selberherr, Siegfried
- 印刷ISSN0026-2714
- 文件大小1239.87KB
- 发表时间2015-6
- DOI10.1016/j.microrel.2015.06.014
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