Stress in three-dimensionally integrated sensor systems
- 期刊名称Microelectronics Reliability
- 作者Filipovic, Lado; Selberherr, Siegfried
- 印刷ISSN0026-2714
- 文件大小2060.88KB
- 发表时间2015-9
- DOI10.1016/j.microrel.2015.09.013
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