[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Experimental investigation on microstructural influence towards visco-plastic mechanical properties of Sn-based solder alloy for material modelling in finite element simulations
Metasch, R.; Schwerz, R.; Roellig, M.; Kabakchiev, A.; Metais, B.; Ratchev, R.; Wolter, K.-J.
- 作者Metasch, R.; Schwerz, R.; Roellig, M.; Kabakchiev, A.; Metais, B.; Ratchev, R.; Wolter, K.-J.
- 文件大小3898.93KB
- 发表时间2015
- DOI10.1109/EuroSimE.2015.7103159
- 页码1-8