[IEEE 2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) - Blacksburg, VA, USA (2015.11.2-2015.11.4)] 2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA) - Application and reliability analysis of sintered silver preforms for die attachment of wide bandgap devices

• 作者Seal, Sayan; Glover, Michael D.; Mantooth, H. Alan
• 文件大小902.36KB
• 发表时间2015
• DOI10.1109/WiPDA.2015.7369326
• 页码377-382