[IEEE 2015 IEEE 35th International Conference on Electronics and Nanotechnology (ELNANO) - Kyiv, Ukraine (2015.4.21-2015.4.24)] 2015 IEEE 35th International Conference on Electronics and Nanotechnology (ELNANO) - Packaging problem in microelectronics due to stress and fracture at the “metal-ceramic” interface
Korobova, N.; Timoshenkov, S.; Britkov, O.; Shepelev, S.; Mikheev, A.
- 作者Korobova, N.; Timoshenkov, S.; Britkov, O.; Shepelev, S.; Mikheev, A.
- 文件大小495.82KB
- 发表时间2015
- DOI10.1109/elnano.2015.7146855
- 页码142-144