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[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology

[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology

Wang, Chuei-Tang; Hsieh, Jeng-Shien; Chang, Victor C. Y.; Yeh, En-Hsiang; Kuo, Feng-Wei; Chen, Hsu-Hsien; Chen, Chih-Hua; Chen, Ron; Lu, Ying-Ta; Jou, Chewn-Pu; Tsai, Hao-Yi; Liu, C. S.; Yu, Doug C. H.
  • 作者Wang, Chuei-Tang; Hsieh, Jeng-Shien; Chang, Victor C. Y.; Yeh, En-Hsiang; Kuo, Feng-Wei; Chen, Hsu-Hsien; Chen, Chih-Hua; Chen, Ron; Lu, Ying-Ta; Jou, Chewn-Pu; Tsai, Hao-Yi; Liu, C. S.; Yu, Doug C. H.
  • 文件大小1144.69KB
  • 发表时间2015
  • DOI10.1109/3dic.2015.7334573
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