Copper Ion Cementation in Presence of a Magnetic Field

• 期刊名称Chemical Engineering & Technology
• 作者Fadali, Olfat A.; Obaid, Mohamed; Mahmoud, Mohamed S.; Farrag, Taha E.; TaeWoo, Kim; Khalil, Khalil Abdelrazek; Barakat, Nasser A. M.
• 卷第38卷
• 期第3期
• 印刷ISSN0930-7516
• 文件大小449.65KB
• 发表时间2015-03
• DOI10.1002/ceat.201400153
• 页码441-445