The Role of Service in the Tourism & Hospitality Industry (Proceedings of the Annual International Conference on Management and Technology in Knowledge, Service, Tourism & Hospitality 2014 (SERVE 2014), Gran Melia, Jakarta, Indonesia, 23-24 August 2014) || ISO 9001:2008 Implementation in higher education: Does it contributes to the student satisfaction?
- 作者Gaol, Ford; Hutagalung, Fonny
- 文件大小258.82KB
- 发表时间2015
- DOI10.1201/b18238-9
- 页码45-50
Semiconductor Packaging (Materials Interaction and Reliability) || Materials used in semiconductor packagingChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || Semiconductor packagesChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || Other packaging needsChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || PolymersChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || MetalsChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || GlossaryChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || The futureChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || Appendix AChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || PolymersChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || MetalsChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || GlossaryChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || The futureChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || Appendix AChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || Appendix BChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || Semiconductor packagesChen, Randy; Lo, rea · 2011
Semiconductor Packaging (Materials Interaction and Reliability) || Package reliabilityChen, Randy; Lo, rea · 2011