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Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Murata, Naokazu; Saito, Naoki; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
  • 期刊名称Journal of Electronic Packaging
  • 作者Murata, Naokazu; Saito, Naoki; Tamakawa, Kinji; Suzuki, Ken; Miura, Hideo
  • 卷第137卷
  • 期第3期
  • 印刷ISSN1043-7398
  • 文件大小5352.98KB
  • 发表时间2015-09-01
  • DOI10.1115/1.4029931
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