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Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration

Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration

Lee, Kangwook; Bea, Jichel; Fukushima, Takafumi; Ramalingam, Suresh; Wu, Xin; Tanaka, Tetsu; Koyanagi, Mitsumasa
  • 期刊名称IEEE Electron Device Letters
  • 作者Lee, Kangwook; Bea, Jichel; Fukushima, Takafumi; Ramalingam, Suresh; Wu, Xin; Tanaka, Tetsu; Koyanagi, Mitsumasa
  • 卷第37卷
  • 期第1期
  • 印刷ISSN0741-3106
  • 电子ISSN1558-0563
  • 文件大小725.67KB
  • 发表时间2016-1
  • DOI10.1109/led.2015.2502584
  • 页码81-83
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