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Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon

Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon

Guo, Xiaoguang; Li, Qiang; Liu, Tao; Zhai, Changheng; Kang, Renke; Jin, Zhuji

期刊名称Materials Science in Semiconductor Processing
作者Guo, Xiaoguang; Li, Qiang; Liu, Tao; Zhai, Changheng; Kang, Renke; Jin, Zhuji
卷第51卷
印刷ISSN1369-8001
文件大小1410.33KB
发表时间2016-08
DOI10.1016/j.mssp.2016.04.013
页码15-19

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