[IEEE 2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) - Fayetteville, AR, USA (2016.11.7-2016.11.9)] 2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) - Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding
- 作者Seal, Sayan; Glover, Michael D.; Wallace, Andrea K.; Mantooth, H. Alan
- 文件大小1516.67KB
- 发表时间2016
- DOI10.1109/WiPDA.2016.7799936
- 页码194-199
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