[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer
Roda Neve, C.; Detalle, M.; Nolmans, P.; Li, Yunlong; De Vos, J.; Van der Plas, G.; Beyer, G.; Beyne, E.
- 作者Roda Neve, C.; Detalle, M.; Nolmans, P.; Li, Yunlong; De Vos, J.; Van der Plas, G.; Beyer, G.; Beyne, E.
- 文件大小786.82KB
- 发表时间2016
- DOI10.1109/3DIC.2016.7970024
- 页码1-4