Advanced Plating Photoresist Development for Semiconductor Packages

• 期刊名称Transactions of The Japan Institute of Electronics Packaging
• 作者Sakakibara, Hirokazu; Akimaru, Hisanori; Hiro, Akito; Sato, Keiichi; Fujiwara, Koichi; Okamoto, Kenji; Kusumoto, Shiro
• 卷第9卷
• 印刷ISSN1883-3365
• 电子ISSN1884-8028
• 文件大小1479.52KB
• 发表时间2016
• DOI10.5104/jiepeng.9.E15-007-01