Thermal rectification under transient conditions: The role of thermal capacitance and thermal conductivity
- 期刊名称Journal of Heat Transfer
- 作者Herrera, Francisco; Luo, Tengfei; Go, David
- 印刷ISSN0022-1481
- 文件大小3824.14KB
- 发表时间2017-03-28
- DOI10.1115/1.4036339
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