Back plate electroplating for high aspect ratio processes
- 期刊名称Microelectronics International
- 作者Marasso, Simone Luigi; Benetto, Simone; Para, Isabella; Ottone, Chiara; Mombello, Domenico; Perrone, Denis; Ferrero, Sergio; Scaltrito, Luciano; Pugliese, Diego; Cocuzza, Matteo; Pirri, Fabrizio Candido
- 卷第34卷
- 期第2期
- 印刷ISSN1356-5362
- 文件大小854.25KB
- 发表时间2017-05-02
- DOI10.1108/MI-03-2016-0024
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