Fast Broadband Modeling of Traces Connecting Vias in Printed Circuit Boards Using Broadband Green's Function Method

• 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
• 作者Huang, Shaowu; Tsang, Leung
• 印刷ISSN2156-3950
• 电子ISSN2156-3985
• 文件大小3423.89KB
• 发表时间2017
• DOI10.1109/TCPMT.2017.2691351
• 页码1-13