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[IEEE 2017 18th International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2017.3.14-2017.3.15)] 2017 18th International Symposium on Quality Electronic Design (ISQED) - STA compatible backend design flow for TSV-based 3-D ICs

[IEEE 2017 18th International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2017.3.14-2017.3.15)] 2017 18th International Symposium on Quality Electronic Design (ISQED) - STA compatible backend design flow for TSV-based 3-D ICs

Kalargaris, Harry; Chen, Yi-Chung; Pavlidis, Vasilis F.
  • 作者Kalargaris, Harry; Chen, Yi-Chung; Pavlidis, Vasilis F.
  • 文件大小380.76KB
  • 发表时间2017
  • DOI10.1109/ISQED.2017.7918314
  • 页码186-190
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