[IEEE 2017 18th International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2017.3.14-2017.3.15)] 2017 18th International Symposium on Quality Electronic Design (ISQED) - STA compatible backend design flow for TSV-based 3-D ICs
Kalargaris, Harry; Chen, Yi-Chung; Pavlidis, Vasilis F.
- 作者Kalargaris, Harry; Chen, Yi-Chung; Pavlidis, Vasilis F.
- 文件大小380.76KB
- 发表时间2017
- DOI10.1109/ISQED.2017.7918314
- 页码186-190