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[IEEE 2017 Design, Automation & Test in Europe Conference & Exhibition (DATE) - Lausanne, Switzerland (2017.3.27-2017.3.31)] Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017 - Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise

[IEEE 2017 Design, Automation & Test in Europe Conference & Exhibition (DATE) - Lausanne, Switzerland (2017.3.27-2017.3.31)] Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017 - Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise

Das, Sourav; Doppa, Janardhan Rao; Pande, Partha Pratim; Chakrabarty, Krishnendu
  • 作者Das, Sourav; Doppa, Janardhan Rao; Pande, Partha Pratim; Chakrabarty, Krishnendu
  • 文件大小241.56KB
  • 发表时间2017
  • DOI10.23919/DATE.2017.7927205
  • 页码1366-1371
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