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Simulation Study of Stress and Deformation Behaviour of Debonded Laminated Structure

Simulation Study of Stress and Deformation Behaviour of Debonded Laminated Structure

Hirwani, C K; Mittal, H; Panda, S K; Mahapatra, S S; Mandal, S K; De, A K

期刊名称IOP Conference Series: Materials Science and Engineering
作者Hirwani, C K; Mittal, H; Panda, S K; Mahapatra, S S; Mandal, S K; De, A K
卷第178卷
印刷ISSN1757-8981
电子ISSN1757-899X
文件大小1028.52KB
发表时间2017-02
DOI10.1088/1757-899X/178/1/012005

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