SPICE level implementation of physics of filamentation in ESD protection devices
- 期刊名称Microelectronics Reliability
- 作者Sinha, Dheeraj Kumar; Chatterjee, Amitabh
- 印刷ISSN0026-2714
- 文件大小1309.22KB
- 发表时间2017-6
- DOI10.1016/j.microrel.2017.05.022
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